First Technology

Always aiming for the top, we thrive in both electronic assembly and<br>
                    semiconductor fields by providing innovative manufacturing solutions.

Information

Mar. 20-22 2024
Productronica China and Semicon China 2024 will be held at the Shanghai World Expo Exhibition & Convention Centre during the period of Mar 20 to 22. We will wait for your visit at our booth E4#4366 and N3#3631.

Productronica China 2024

Semicon China 2024

Oct. 11-13 2023
Nepcon ASIA will be held at the Shenzhen World Exhibition & Convention Center (Baoan New Hall) during the period of Oct 11 to 13. We will wait for your visit at our booth #7B80.

NEPCON ASIA 2023

Jul. 19-21 2023
Nepcon China will be held at the Shanghai World Expo Exhibition & Convention Centre July 19 to 21. We will wait for your vist at our booth #1G55.

NEPCON CHINA 2023

Exhibition Report

Partner’s voice Partner’s voice X-Sinter P200X X-Sinter P200X Since its debut in 2003, FUJI NXT has achieved a successful shipment figure of 100,000 ! Since its debut in 2003, FUJI NXT has achieved a successful shipment figure of 100,000 !
Surface Mount Technology

Centered around products from the leading manufacturer FUJI, we provide a variety of equipments that are essential for SMT line configulation. Counting the experience of its predecessor company Schmidt, First Technology has been in the leading edge of the Chinese electronics equipmet market for over 40 years. With our outstanding professional achievements in the Chinese market, we can recommend the best products not only from the world top brand, but also from Chinese manufacturers to customers looking to supply locally. more info

SurfaceMountTechnology
Semiconductor

Specialising in semiconductor packaging and testing, we select the best equipments suited for our customer's situational needs. For power semiconductor device and power modules, we handle range of products, mainly wedge bonder and ribbon bonder from the market's leading brand Kulicke&Soffa. Our expertiese are unlimited to semicondutors, and we are absolutely confident in being able to provide the best equipments for related fields as well (advance package and optoelectronics as examples). more info

SurfaceMountTechnology

X-Sinter P200X

X-Sinter P201X

Basic Specification:
Micropunch system AMX [patented];
Large Sintering Area 350mm x 270mm
Sintering force Up to 980 Kn;
Controlled atmosphere full chamber (Nitrogen N2 or other) ;
Load cell force measurement for quality control;
Compact desing W1400 x D1600 x H1600 mm;
Full in line solution / carrier;
Proprietary software easy interface;
Customer tray;
Pass pass through option;
Automatic protective film feeding

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